• Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
  • Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
  • Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
  • Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
  • Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
  • Copper Clad Laminates for PCB, Xpc/Fr1/Fr2

Copper Clad Laminates for PCB, Xpc/Fr1/Fr2

Structure: Double-Sided Rigid PCB
Dielectric: FR-2
Material: Phenolic Paper Laminate
Application: Consumer Electronics
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Gold Member Since 2019

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Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
XPC
Production Process
Additive Process
Base Material
Phenolic Paper
Insulation Materials
Organic Resin
Brand
Hjh
Transport Package
Pallet
Specification
1030*1230MM
Trademark
HJH
Origin
China
HS Code
7410211000
Production Capacity
10000000000sheets/Year

Product Description

FR-2 Copper Clad Laminate

Properties:
Less odor
Halogen-free, Friendly to the environment.
High CTI over 600V
Superior heat and humidity resistance
Suitable for punching at 40-70ºC
Warpage and twist are small and stable.                           

Applications :
Widely used for computers,telephones,Hi-Fi acoustic devices,
Electronic toys and etc.

Main Technical Characteristics
Test  Item Unit Test Condition Specification Typical Value
Solder Resistance(260ºC) Sec A ≥10 20~30
Heat Resistance - 130ºC 30min No Change No Change
Peel Strength(Copper Foil 35µm) Kgf/cm A
260ºC/10Sec
≥1.2 1.8~2.0
1.7-1.9
Flexural Lengthwise Kgf/² A ≥8 14-16
Crosswise ≥8 13-14
Volume Resistivity Ω- C-96/20/65
C-96/20/65+C-96/40/90
5×1010
5×109
 
1.0×1012~1013
1.0×1012~1013
Surface Resistivity Adhesive Side Ω C-96/20/65
C-96/20/65+C-96/40/90
1×1012
1×1011
1.0×1012~1013
1.0×1011~1012
Laminate Side C-96/20/65
C-96/20/65+C-96/40/90
1×1011
1×108
1.0×1011~1012
1.0×1010~1011
Insulation Resistance Ω C-96/20/65
C-96/20/65+D-2/100
1×1011
1×108
1.0×1011~1012
1.0×109~1010
Chemical Resistance - 3%NaOH 40ºC 3min No Change No  Change
Boiled in trichloroethylene for 3min
No  Change
Moisture Absorption % E-24/50+D-24/23 ≤0.75 0.5~0.75
Flammability Rating A UL94V-0 V-0
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-24/23
≤5.0 3.5~5.0
≤5.3 4.0~5.3
Dissipation  Factor - C-96/20/65
C-96/20/65+D-24/23
≤0.04 0.025~0.035
≤0.05 0.030~0.045
CTI Value V 0.1% NH4CL ≥600 ≥600
Punching Temperature ºC A 40-70 40-70
 
Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
 
Copper Clad Laminates for PCB, Xpc/Fr1/Fr2
Copper Clad Laminates for PCB, Xpc/Fr1/Fr2


FAQ
Q: Are you trading company or manufacturer ?
A: Both


Q: How long is your delivery time?
A: Generally it is 3-5 days if the goods are in stock. or it is 5--15days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ?is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.


Q: What is your terms of payment ? A: Payment<=2000USD, 100% in advance. Payment>=2000USD, 30% T/T in advance ,balance before shipment.

 

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