Structure: | Single-Sided Rigid PCB |
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Dielectric: | FR-2 |
Material: | Phenolic Paper Laminate |
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Test Item | Unit | Test Condition | Specification | Typical Value | ||
Solder Resistance(260ºC) | Sec | A | ≥10 | 20~30 | ||
Heat Resistance | - | 130ºC 30min | No Change | No Change | ||
Peel Strength(Copper Foil 35µm) | Kgf/cm | A 260ºC/10Sec |
≥1.2 | 1.8~2.0 1.7-1.9 |
||
Flexural | Lengthwise | Kgf/² | A | ≥8 | 14-16 | |
Crosswise | ≥8 | 13-14 | ||||
Volume Resistivity | Ω- | C-96/20/65 C-96/20/65+C-96/40/90 |
5×1010 5×109 |
1.0×1012~1013 1.0×1012~1013 |
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Surface Resistivity | Adhesive Side | Ω | C-96/20/65 C-96/20/65+C-96/40/90 |
1×1012 1×1011 |
1.0×1012~1013 1.0×1011~1012 |
|
Laminate Side | C-96/20/65 C-96/20/65+C-96/40/90 |
1×1011 1×108 |
1.0×1011~1012 1.0×1010~1011 |
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Insulation Resistance | Ω | C-96/20/65 C-96/20/65+D-2/100 |
1×1011 1×108 |
1.0×1011~1012 1.0×109~1010 |
||
Chemical Resistance | - | 3%NaOH 40ºC 3min | No Change | No Change | ||
Boiled in trichloroethylene for 3min | ||||||
No Change | ||||||
Moisture Absorption | % | E-24/50+D-24/23 | ≤0.75 | 0.5~0.75 | ||
Flammability | Rating | A | UL94V-0 | V-0 | ||
Dielectric Constant(1MHz) | - | C-96/20/65 C-96/20/65+D-24/23 |
≤5.0 | 3.5~5.0 | ||
≤5.3 | 4.0~5.3 | |||||
Dissipation Factor | - | C-96/20/65 C-96/20/65+D-24/23 |
≤0.04 | 0.025~0.035 | ||
≤0.05 | 0.030~0.045 | |||||
CTI Value | V | 0.1% NH4CL | ≥600 | ≥600 | ||
Punching Temperature | ºC | A | 40-70 | 40-70 |