| Structure: | Single/Double-Sided Rigid PCB |
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| Dielectric: | FR-4 |
| Material: | Epoxy Fiber Galss Laminate |
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| Test Items | Unit | Test Condition | Test Method IPC-TM-650 |
Specification | Typical Value | |
| Tg | ºC | DSC | 2.4.25 | ≥130 | 135 | |
| Peel strength 1oz | N/mm | 288ºC, 10s | 2.4.8 | ≥1.05 | 1.45 | |
| Flammability | Rating | C-48/23/50 | UL94 | V-0 | V-0 | |
| E-24/125 | ||||||
| Surface Resistivity | MΩ | C-96/35/90 | 2.5.17.1 | 104 | 2.0 X106 | |
| Volume Resistivity | MΩ-cm | C-96/35/90 | 2.5.17.1 | 106 | 5.0 X108 | |
| Arc Resistance | S | D-48/50+D-0.5/23 | 2.5.1 | 60 | 124 | |
| Dielectric Breakdown | KV | D-48/50+D-0.5/23 | 2.5.6 | 40 | 56 | |
| Dielectric Constant (1MHz) |
_ | C-24/23/50 | 2.5.5.2 | <5.4 | 4.7 | |
| Dissipation Factor (1Mhz) |
_ | C-24/23/50 | 2.5.5.9 | <0.035 | 0.016 | |
| Thermal Stress |
Unetched | Sec | 288ºC, solder dip | 2.4.13.1 | ≥30 | Pass |
| Etched | ||||||
| Flexural Strength | LW | MPa | A | 2.4.4 | 415 | 565 |
| CW | 345 | 430 | ||||
| Water absorption | % | D-24/23 | 2.6.2.1 | 0.35 | 0.21 | |
| CTE Z-axis |
Before Tg | μm/mºC | TMA | 2.4.24 | ≤60 | 50 |
| After Tg | μm/mºC | TMA | ≤300 | 280 | ||
| 50~260ºC | % | TMA | ≤3.0 | 2.9 | ||
| Td | ºC | 10ºC/min, N2,5% Wt Loss | 2.4.24.6 | ≥340 | 340 | |
| T260 | Min | TMA | 2.4.24.1 | - | 15 | |
| T288 | Min | TMA | 2.4.24.1 | - | 2 | |
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