| Structure: | Single-Sided Rigid PCB |
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| Dielectric: | Xpc |
| Material: | Phenolic Paper Laminate |
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| Test Item | Unit | Test Condition | Specification | Typical Value | ||
| Solder Resistance(260ºC) | Sec | A | ≥10 | 15~30 | ||
| Heat Resistance | - | 130ºC 30min | No Change | No Change | ||
| Peel Strength(Copper Foil 35µm) | Kgf/cm | A 260ºC/10Sec |
≥1.2 | 1.2~1.7 1.2~1.7 |
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| Flexural | Lengthwise | Kgf/mm² | A | ≥8 | 14-16 | |
| Crosswise | ≥8 | 13-14 | ||||
| Volume Resistivity | Ω-cm | C-96/20/65 C-96/20/65+C-96/40/90 |
5×109 5×108 |
1.0×1012~1013 1.0×1010~1011 |
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| Surface Resistivity | Adhesive Side | Ω | C-96/20/65 C-96/20/65+C-96/40/90 |
1×1010 1×109 |
1.0×1011~1012 1.0×1010~1011 |
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| Laminate Side | C-96/20/65 C-96/20/65+C-96/40/90 |
1×109 1×107 |
1.0×1010~1011 1.0×109~1010 |
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| Insulation Resistance | Ω | C-96/20/65 C-96/20/65+D-2/100 |
1×109 1×106 |
1.0×1010~1011 1.0×107~108 |
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| Chemical Resistance | - | 3%NaOH 40ºC 3min | No Change | No Change No Change |
||
| Boiled in trichloroethylene for 3min | ||||||
| Moisture Absorption | % | E-24/50+D-24/23 | ≤2 | 1.0~1.5 | ||
| Flammability | Sec | A | 94HB | 94HB | ||
| Dielectric Constant(1MHz) | - | C-96/20/65 C-96/20/65+D-24/23 |
≤5.5 | 4.0~5.0 | ||
| ≤6.0 | 4.5~5.5 | |||||
| Dissipation Factor | - | C-96/20/65 C-96/20/65+D-24/23 |
≤0.05 | 0.025~0.035 | ||
| ≤0.1 | 0.035~0.045 | |||||
| CTI Value CIT | V | 0.1% NH4CL | ≥150 | 150-200 | ||
| Punching Temperature | ºC | A | 50-70 | Ambient~70 | ||
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