18/00 1.0mm 41"X49" Fr4 Copper Clad Laminate Sheet Ccl for PCB

• Structure: Single/Double-Sided Rigid PCB
• Dielectric: FR-4
• Material: Epoxy Fiber Galss Laminate
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: FR4
• Application: Consumer Electronics
• Flame Retardant Properties: V0, V1
• Processing Technology: Electrolytic Foil
• Production Process: Additive Process
• Base Material: Epoxy Fiber Galss
• Insulation Materials: Epoxy Resin
• Brand: Hjh
• Sheet Thickness: 0.05-3.5mm
• Copper Thickness: 18um, 35um, 105um, Others
• Color: Yellow
• Market: Euro, Asia, Central and South America
• Transport Package: Pallet
• Specification: 41"x49", 43"x49", 1040x1245mm, 1090x1245mm, others
• Trademark: HJH
• Origin: China
• HS Code: 7410211000
• Production Capacity: 200000 Sheets Per Month
• Package Size: 128.00cm * 108.00cm * 57.00cm
• Package Gross Weight: 1106.000kg

Product Description

FR4 Copper Clad Laminate Sheet

1.FEATURES
--Tg135±5ºC(DSC)   
--Halogen-free, Br/Cl content below 900ppm                                                                
--UV Blocking/ AOI Compatible  
--Antimony-free                                        
--Conform to claim of RoHS  
--IPC-4101B specification is applicable

2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.
                                  

3.TECHNICAL DATA SHEET

Test Items		Unit	Test Condition	Test Method IPC-TM-650	Specification	Typical Value
Tg		ºC	DSC	2.4.25	≥130	135
Peel strength 1oz		N/mm	288ºC, 10s	2.4.8	≥1.05	1.45
Flammability		Rating	C-48/23/50	UL94	V-0	V-0
			E-24/125
Surface Resistivity		MΩ	C-96/35/90	2.5.17.1	10^4	2.0 X10^6
Volume Resistivity		MΩ-cm	C-96/35/90	2.5.17.1	10^6	5.0 X10^8
Arc Resistance		S	D-48/50+D-0.5/23	2.5.1	60	124
Dielectric Breakdown		KV	D-48/50+D-0.5/23	2.5.6	40	56
Dielectric Constant              (1MHz)		_	C-24/23/50	2.5.5.2	<5.4	4.7
Dissipation Factor              (1Mhz)		_	C-24/23/50	2.5.5.9	<0.035	0.016
Thermal Stress	Unetched	Sec	288ºC, solder dip	2.4.13.1	≥30	Pass
	Etched
Flexural Strength	LW	MPa	A	2.4.4	415	565
	CW				345	430
Water absorption		%	D-24/23	2.6.2.1	0.35	0.21
CTE Z-axis	Before Tg	μm/mºC	TMA	2.4.24	≤60	50
	After Tg	μm/mºC	TMA		≤300	280
	50~260ºC	%	TMA		≤3.0	2.9
Td		ºC	10ºC/min, N2,5% Wt Loss	2.4.24.6	≥340	340
T260		Min	TMA	2.4.24.1	-	15
T288		Min	TMA	2.4.24.1	-	2