Epoxy Fiberglass Paper Cem1 Ccl Copper Clad Laminate Sheet for PCB

• Structure: Single-Sided Rigid PCB
• Dielectric: CEM-1
• Material: Epoxy Fiber Galss Paper
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: CEM1
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Additive Process
• Base Material: Epoxy Fiber Galss Paper
• Insulation Materials: Epoxy Resin
• Brand: Hjh
• Sheet Thickness: 0.8-1.6mm
• Copper Thickness: 18um, 25um, 35um, Others
• Color: White, Yellow
• Market: Euro, Asia, Central and South America
• Transport Package: Pallet
• Specification: 1030*1230MM
• Trademark: HJH
• Origin: China
• HS Code: 7410211000
• Production Capacity: 200000 Sheets Per Month
• Package Size: 128.00cm * 108.00cm * 95.00cm
• Package Gross Weight: 1547.000kg

Product Description

CEM1 Copper Clad Laminate Sheet

1.FEATURES

--Excellent punching property, Suitable for punching at 45ºC~70ºC                           
--Good heat resistance and moisture resistance                                                

--IPC 4101 specification is applicable                        

--Plated through holes are not recommended for the

   cellulose core is easily attacked by the electrolyte


2.APPLICATION
Display, VCR, Power supply, Industrial Instrument, Digital sound recorder, etc.

                                  

3.TECHNICAL DATA SHEET

Test Item	Unit	Test Method (IPC-TM-650)	Test Condition	Spec(IPC-4101)	Typical Value
Peel Strength(1oz)	N/mm	2.4.8	125ºC	--	1.65
			Float 260ºC/10Sec	≥1.05	1.70
Thermal Stress	Sec	2.4.13.1	Float288ºC/unetched	≥10	20
Bow/Twist	%	2.4.22.1	A	≥1.5	0.3/0.4
Flexural Strength	N/mm^2	2.4.4	Warp	≥242	420
			Fill	≥172	290
Flammability	Rating	UL94	UL-94	UL94 V-0	V-0
Surface Resistance	MΩ	2.5.17.1	C-96/35/90	≥1.0 x 10^4	1.0 x 10^6
Volume Resistance	MΩ-cm	2.5.17.1	C-96/35/90	≥1.0 x 10^6	1.0 x 10^8
Z-axis Expansion	ppm/ºC	2.4.24	E2/--105 TMA	--	100/320
	%			--	6.0
Dielectric Constant	---	2.5.5.2	Etched/@1MHZ	≤5.4	4.6
Loss Tangent	---	2.5.5.2	Etched/@1MHZ	≤0.035	0.023
Arc Resistance	Sec	2.5.1	D-48/50+D-0.5/23	≥60	125
Moisture Absorption	%	2.6.2.1	D-24/23	≤0.5	0.25
CTI	V	IEC 112	Etched/0.1% NH4CI	AABUS	175/300/600