Structure: | Single-Sided Rigid PCB |
---|---|
Dielectric: | CEM-3 |
Material: | Fiber Galss/Epoxy/Copper Foil |
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Peel Strength(1oz) | Unit | Test Method (IPC-TM-650) |
Test Condition | Spec(IPC-4101) | Typical Value |
Thermal Stress | N/mm | 2.4.8 | 125ºC | AABUS | 1.75 |
Float 260ºC,10Sec | AABUS | 1.79 | |||
Bow/Twist | Sec | 2.4.13.1 | Float260ºC/unetched | ≥10 | 60 |
Flexural Strength | % | 2.4.22.1 | A | ≤1.0 | 0.5/0.8 |
Flammability | N/mm2 | 2.4.4 | Warp | ≥276 | 355 |
Fill | ≥186 | 293 | |||
Surface Resistance | Rating | UL94 | UL-94 | UL94 V-0 | V-0 |
Volume Resistance | MΩ | 2.5.17.1 | C-96/35/90 | ≥1.0 x 104 | 1.0 x 106 |
Dielectric Constant | MΩ-cm | 2.5.17.1 | C-96/35/90 | ≥1.0 x 106 | 1.0 x 107 |
--- | 2.5.5.2 | Etched/@1MHZ | ≤5.4 | 4.5 | |
Loss Tangent | --- | 2.5.5.2 | Etched/@1MHZ | ≤0.035 | 0.020 |
Arc Resistance | Sec | 2.5.1 | D-48/50+D-0.5/23 | ≥60 | 128 |
Moisture Absorption | % | 2.6.2.1 | D-24/23 | ≤0.5 | 0.20 |
CTI | V | IEC 112 | Etched/0.1% NH4CI | ≥175 | 175/300/600 |