India Market 1000*1200mm 1.0mm 25/00 1tc Al Ccl for LED PCB

• Structure: Single-Sided Rigid PCB
• Dielectric: Rcc
• Material: Aluminum Base
• Model NO.: AL base
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Additive Process
• Base Material: Aluminum
• Insulation Materials: Rcc
• Brand: Hjh
• Sheet Thickness: 0.6-2.0mm
• Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others
• Protective Film Color: Green
• Thermal Conductivity: 0.6~2.0W
• Aluminum Base Material: 1060 / 5052
• Tg (DSC): >130 Degree
• Breakdown Voltage: AC>/=5kv
• Transport Package: Pallet
• Specification: 1000*1200MM, 500*600MM, others
• Trademark: HJH
• Origin: China
• HS Code: 7410211000
• Production Capacity: 200000 Sheets Per Month
• Package Size: 123.00cm * 103.00cm * 58.00cm
• Package Gross Weight: 1343.000kg

Product Description

Aluminum Copper Clad Laminate Sheet                         

This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.

Properties
High mechanical strength and dimensional stability, 
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting

Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.

Specifications
AL base materials: 1060, 5052

Sheet Thickness: 0.6~2.0mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm

Thermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.K

Protective film: blue film (80ºC), green film (160ºC)

Main Technical Characteristics

Items	Unit	Test condition	Typical values
			AF-01	AF-04	AF-05
Peel strength	N/mm	At normal: A	2.00	1.05	1.08
		After thermal stress	1.80	1.05	1.05
Surface resistance	MΩ	At normal	5.0 x 10^7	5.0 x 10^7	3.6 x 10^7
		Constant humidity treatment	2.0 x 10^6	4.5 x 10^6	3.3 x 10^6
Volume resistance	MΩ·m	At normal	4.0 x 10^8	1.0 x 10^8	4.2 x 10^8
		Constant humidity treatment	5.0 x 10^7	1.9 x 10^7	3.1 x 10^7
Thermal resistance	ºC/w	At normal	1.0	0.65	0.45
Dielectric Constant @ 1 MHz	--	40ºC, 93%, 96h	4.2	4.2	4.2
Dielectric dissipation factor @1 MHz	--	40ºC, 93%, 96h	0.02	0.029	0.033
Thermal stress	min	260ºC	2 min, no delamination, no air bulb
Dielectric breakdown	KV/MM	At normal	31	31	60
Flammability	--	At normal	FV-0
Thermal-conductive factor	W/m·k	At normal	1.0	1.5	2.2