• Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
  • Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
  • Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
  • Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
  • Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
  • Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit

Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit

Structure: Single-Sided Rigid PCB
Dielectric: FR-4
Material: Fiber Galss/Epoxy/Copper Foil
Application: Consumer Electronics
Flame Retardant Properties: V0
Processing Technology: Delay Pressure Foil
Gold Member Since 2019

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Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
fr4
Production Process
Laminateing
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
Hjh
Transport Package
Pallet
Specification
Metri ton
Trademark
HJH
Origin
China
HS Code
7410211000
Production Capacity
10000000000PCS/Month

Product Description

1.FEATURES
--Tg135±5ºC(DSC)   
--Halogen-free, Br/Cl content below 900ppm                                                                
--UV Blocking/ AOI Compatible  
--Antimony-free                                        
--Conform to claim of RoHS  
--IPC-4101B specification is applicable

2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.
                                  

3.TECHNICAL DATA SHEET
 Test Items  Unit Test Condition Test Method
IPC-TM-650
Specification Typical Value
Tg ºC DSC 2.4.25 ≥130 135
Peel strength 1oz N/mm 288ºC, 10s 2.4.8 ≥1.05 1.45
Flammability Rating C-48/23/50 UL94 V-0 V-0
E-24/125
Surface Resistivity C-96/35/90 2.5.17.1 104 2.0 X106
Volume Resistivity MΩ-cm C-96/35/90 2.5.17.1 106 5.0 X108
Arc Resistance S D-48/50+D-0.5/23 2.5.1 60 124
Dielectric Breakdown KV D-48/50+D-0.5/23 2.5.6 40 56
Dielectric Constant
             (1MHz)
_ C-24/23/50 2.5.5.2 <5.4 4.7
Dissipation Factor
             (1Mhz)
_ C-24/23/50 2.5.5.9 <0.035 0.016
Thermal
Stress
Unetched Sec 288ºC, solder dip 2.4.13.1 ≥30 Pass
Etched
Flexural Strength LW MPa A 2.4.4 415 565
CW 345 430
 Water absorption % D-24/23 2.6.2.1 0.35 0.21
CTE
Z-axis
Before Tg μm/mºC TMA 2.4.24 ≤60 50
After Tg μm/mºC TMA ≤300 280
50~260ºC % TMA ≤3.0 2.9
Td ºC 10ºC/min, N2,5% Wt Loss 2.4.24.6 ≥340 340
T260 Min TMA 2.4.24.1 - 15
T288 Min TMA 2.4.24.1 - 2
Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
 
Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit
Hot Products Fr4 Copper Clad Laminate Sheet for PCB Circuit






FAQ
Q: Are you trading company or manufacturer ?
A: Both


Q: How long is your delivery time?
A: Generally it is 3-5 days if the goods are in stock. or it is 5--15days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ?is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.


Q: What is your terms of payment ? A: Payment<=2000USD, 100% in advance. Payment>=2000USD, 30% T/T in advance ,balance before shipment.
 

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