Ccl Copper Clad Laminate Sheet for PCB

Product Details
Structure: Double-Sided Rigid PCB
Dielectric: FR-4
Material: Epoxide Woven Glass Fabric Laminate
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Registered Capital
1000000 RMB
Plant Area
101~500 square meters
  • Ccl Copper Clad Laminate Sheet for PCB
  • Ccl Copper Clad Laminate Sheet for PCB
  • Ccl Copper Clad Laminate Sheet for PCB
  • Ccl Copper Clad Laminate Sheet for PCB
  • Ccl Copper Clad Laminate Sheet for PCB
  • Ccl Copper Clad Laminate Sheet for PCB
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Basic Info.

Model NO.
FR4
Application
Consumer Electronics
Flame Retardant Properties
V0
Processing Technology
Delay Pressure Foil
Production Process
Additive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Hjh
Sheet Thickness
0.05-3.5mm
Copper Thickness
18um, 35um, 105um, Others
Color
Yellow
Market
Euro, Asia, Central and South America
Transport Package
Pallet
Trademark
HJH
Origin
China
HS Code
7410211000
Production Capacity
10000000000sheets/Year

Packaging & Delivery

Package Size
128.00cm * 108.00cm * 58.00cm
Package Gross Weight
1106.000kg

Product Description

FR4 Copper Clad Laminate Sheet

1.FEATURES

--Tg135±5ºC(DSC)   
--Halogen-free, Br/Cl content below 900ppm                                                                
--UV Blocking/ AOI Compatible  
--Antimony-free                                        
--Conform to claim of RoHS  
--IPC-4101B specification is applicable

2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.
                                  

3.TECHNICAL DATA SHEET
 Test Items  Unit Test Condition Test Method
IPC-TM-650
Specification Typical Value
Tg ºC DSC 2.4.25 ≥130 135
Peel strength 1oz N/mm 288ºC, 10s 2.4.8 ≥1.05 1.45
Flammability Rating C-48/23/50 UL94 V-0 V-0
E-24/125
Surface Resistivity C-96/35/90 2.5.17.1 104 2.0 X106
Volume Resistivity MΩ-cm C-96/35/90 2.5.17.1 106 5.0 X108
Arc Resistance S D-48/50+D-0.5/23 2.5.1 60 124
Dielectric Breakdown KV D-48/50+D-0.5/23 2.5.6 40 56
Dielectric Constant
             (1MHz)
_ C-24/23/50 2.5.5.2 <5.4 4.7
Dissipation Factor
             (1Mhz)
_ C-24/23/50 2.5.5.9 <0.035 0.016
Thermal
Stress
Unetched Sec 288ºC, solder dip 2.4.13.1 ≥30 Pass
Etched
Flexural Strength LW MPa A 2.4.4 415 565
CW 345 430
 Water absorption % D-24/23 2.6.2.1 0.35 0.21
CTE
Z-axis
Before Tg μm/mºC TMA 2.4.24 ≤60 50
After Tg μm/mºC TMA ≤300 280
50~260ºC % TMA ≤3.0 2.9
Td ºC 10ºC/min, N2,5% Wt Loss 2.4.24.6 ≥340 340
T260 Min TMA 2.4.24.1 - 15
T288 Min TMA 2.4.24.1 - 2

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Ccl Copper Clad Laminate Sheet for PCB
FAQ
Q: Are you trading company or manufacturer ?
A: Both


Q: How long is your delivery time?
A: Generally it is 3-5 days if the goods are in stock. or it is 5--15days if the goods are not in stock, it is according to quantity.


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A: Yes, we could offer the sample for free charge but do not pay the cost of freight.


Q: What is your terms of payment ?
A: Payment<=
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